10cc No-Clean Soldering Paste with Needle Flux RMA-218

Introducing the RMA-218 High Viscosity No-Clean Flux, designed for precision in electronic assembly and repair. Perfect for rework and attachment in BGA, CGA, and CSP packages, this flux offers superior performance in Flip Chip attachments on PWB substrates. Its unique formulation ensures reliable adherence in BGA reballing, making it an essential tool for professionals.

Key Features:

- High Viscosity No-Clean Formula: Ideal for precision applications and clean work without residues.
- Versatile Usage: Perfect for rework, sphere or pin attachment, and Flip Chip assembly.
- Effective for BGA Reballing: Ensures strong adhesion and efficiency.
- Package Options: Available in sets of 10 or 20 with accompanying aluminum alloy putters.
- Authenticity Check: Genuine product is white; beware of inferior yellowish imitations.

Choose the RMA-218 for uncompromised quality and performance in your electronics projects.