10cc No-Clean Solder Paste Flux for BGA PCB, Welding, Repair - 100% Original Paste

This high-quality, lead-free solder paste is perfect for a variety of applications, including BGA, PGA, CSP packages, and flip chip operations. It offers excellent solder stickiness and anti-wet capacity, making it ideal for professional repair work and multiple PCB reflow processes. With a no-clean formulation, it's environmentally friendly and simplifies your workflow.

This solder paste is essential for tasks such as reworking, sphere or pin attachment, and assembling flip chip attachments to PWB substrates. It comes with both needles and a piston for easy application. Available in multiple quantities to suit your needs, it supports both wholesale and dropshipping.

Features:
- Application: BGA, PGA, CSP Packages and Flip Chip Operations
- Flux Type: NC-559-ASM (includes needles and piston)
- Certification: CE, RoHS compliant
- No-clean and lead-free for easy handling and environmental protection
- Usage: Ideal for mobile phone repair and PCB reflow
- Particle Size: 10-25μm
- Weight: 17.5g per unit

Package Options:
- Available in packs of 1, 2, 5, or 10

Shipping options include safe and fast logistics channels like DHL and FedEx for bulk orders.